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The secondary configuration project of the semiconductor chip cleanroom, dust-free room and clean factory
2025/11/6
01 Be familiar with the production process of chips
For the secondary configuration of process equipment in chip cleanrooms, dust-free rooms and clean workshops, the first thing that professional contractors should be familiar with and master is the process production flow, which plays a crucial role in the secondary configuration of process equipment. The production process flow determines the floor plan of the workshop and the spatial position of process equipment, which is conducive to the planning and management of secondary distribution pipelines in advance and improves the efficiency of secondary distribution work. The production process of chips is roughly divided into 11 steps, namely:
1.1 Source of Silicon wafers
Silicon wafers are generally cut from crystal rods and are sliced into thin silicon wafers as required.
1.2 Cleaning
Chips need to be cleaned before processing. Cleaning equipment is usually divided into grid oxidation cleaning machines and oxidation diffusion cleaning machines.
1.3 Oxidation
The oxidation process involves sending the cleaned and centrifugally spun silicon wafers into high-temperature furnace tubes for annealing treatment, with the temperature inside the tubes ranging from 800 to 1500℃.
1.4 Deposition
The deposition system is a device system that forms a high-quality metal film with good step coverage ability, good contact and uniformity on the surface of silicon wafers.
1.5 Lithography
Lithography involves coating a silicon wafer with a chemical substance sensitive to ultraviolet light, which softens when exposed to ultraviolet light. The shape of the chip is obtained by controlling the position of the light-blocking object. That is, a photoetchant is coated on the silicon wafer so that it dissolves when exposed to ultraviolet light. Under the exposure effect of the photolithography machine, the part directly exposed to ultraviolet light is dissolved, and this dissolved part can then be washed away with a solvent.
1.6 Etching
Etching is the process of removing silicon ammonide and the damage layer formed on the surface of silicon wafers due to processing stress after the previous several processing steps by chemical etching or dry oxidation.
1.7 Secondary Cleaning
Secondary cleaning involves subjecting the processed silicon wafers to another round of strong acid and alkali cleaning and spin-drying to remove the photoresist on the silicon wafer boards.
1.8 Ion Implantation
Ion implantation involves placing the etched chip into a large or medium beam implanter to allow boron ions (B+3) to pass through the sio2 membrane and be injected into the substrate, forming a P-type well. Remove the silicon ammonide layer and dope phosphorus (P+5) ions to form an N-type well.
1.9 Rapid Annealing
Rapid annealing involves taking silicon wafers out of an ion implanter and placing them in a rapid annealing furnace for annealing treatment to remove the sio2 layer. The ion implantation process is repeatedly cycled as needed.
1.10 Evaporation
The deposition methods of thin films vary according to their different uses, and the thickness is usually less than 1 μ m. It is divided into vacuum evaporation method and sputtering method.
1.11 Detection
Testing is the final and comprehensive inspection to ensure that the product ultimately meets the specified technical indicators such as size, shape, surface finish, and flatness. Finally, fix the individual grains on the plastic or ceramic chip base, and connect some of the etched lead terminals on the grains to the pins extending from the bottom of the base for connection with the external circuit board. Finally, cover it with a plastic cover plate and seal it with glue.
1.12 Packaging
The finished products are separated, wrapped and boxed with flexible materials, and are ready to be sent to the customers who have placed orders.
02 Special pipelines should be given special attention
Through familiarity and mastery of the chip production process, our understanding of the process has become deeper, and thus we have also gained a thorough understanding of the special requirements for process equipment. However, for the effective implementation of secondary distribution engineering, it is still necessary to have a clear and profound understanding and mastery of the demand conditions for process equipment, as well as a thorough understanding and mastery of the access conditions and interface forms of process equipment. In this way, Only in this way can the secondary distribution project be completed efficiently and quickly under the condition of ensuring the quality and safety of the project.
Regarding the layout of the special gas station and the secondary design of the special gas pipeline, such chip production workshops need to use special gas. The quality of the configuration of the special gas station and the secondary design of the special gas transmission and distribution pipeline directly affects the secondary distribution project and the commissioning operation of the equipment. Therefore, it is necessary to carry out secondary design in the special gas station and the transmission and distribution pipelines in advance.
Special attention should be paid to 2 special pipelines
2.1 SUS304BA pipe
Since such pipelines are mainly used for transporting high-purity gases and special gases, they must be constructed strictly in accordance with the construction methods. Track chlorine arc welding machines should be adopted, and welding samples should be carried out before welding to ensure the quality of the welding. At the same time, the welding equipment should also have backup measures to ensure that the construction period is met during the peak welding period.
2.2 PVDF pipes
This type of pipeline mainly uses high-purity water for fitting, which has a serious impact on the process production. The connection of such pipelines is mainly carried out by a dedicated infrared welding machine. One must be trained before taking up the post to ensure the quality of welding. At the same time, corresponding tests should be conducted after the welding is completed to ensure the cleanliness of the pipeline.
2.3 Double-layer Pipe
This type of pipeline is mainly used for discharging chemical liquids, so its construction must be trained and corresponding tests must be conducted after construction to ensure zero risk.
2.4SCH80 PVC pipe
This type of road mainly transports acid and alkali solutions. Therefore, the reliability of its bonding is of vital importance for the discharge of acid and alkali solutions, and the key points of its construction should be trained with emphasis.
3. Preparation of special accessories
As most of the process equipment in the chip workshop is imported old equipment, its interface forms are diverse, and some accessories are lost or fallen off, it is necessary to reequip them.
The commonly used interface forms include welding, flange, VCR, ferrule and other connection forms. However, there are also ISO flange connections, PVDF/PFA conversion joints and other forms. Some of these accessories still need to be imported, and sometimes the project progress may be affected due to the shortage of a certain accessory. Therefore, with a thorough understanding of such process equipment, it is necessary to stock up on various connection forms of accessories in sufficient quantities to ensure the requirements of the secondary assembly period.
4. Fully understand the one-time matching
The interface range of the secondary distribution is mainly from the reserved point of the primary distribution to the connection point of the process equipment. Therefore, the depth of understanding of the first blending directly affects the quality and progress of the second blending. Before the secondary matching begins, a drawing review for the primary matching should be organized based on the requirements of the secondary matching. The main checks include whether the reserved points for the primary matching are sufficient, whether the interface pipe diameters meet the requirements, and how the positions are allocated, etc.
At the same time, feedback and corrections should be made based on the verification results, and the preliminary design of the secondary distribution plan should be carried out. The main contents of the design include the selection of pipe materials and fittings, the spatial layout of pipelines, the setting of control valves, the setting of metering equipment, etc. After the preliminary plan is determined, the inventory of various valves and fittings can be prepared.
5. Establish regular meetings on the progress of secondary distribution
Due to the measurability of process equipment and the certainty of points, the progress of secondary distribution is generally mainly measured by points. When holding regular meetings, there are mainly the following key points:
(1) The entry time of process equipment, as well as the MOVE IN time and positioning time;
(2) The confirmation time for the secondary allocation of the positioned equipment by both Party A and Party B;
(3) The daily completion quantity and completion time of the determined points;
(4) The arrival time of various materials for secondary distribution.
Based on the above several time points, they play a decisive role in the progress of the secondary matching.
6. Establish effective safety, quality and environmental management systems
In clean rooms, the protection of finished products during secondary mixing construction is particularly important. Once the primary mixing is completed, a complete set of finished product protection measures should be established to ensure that the secondary construction does not damage the primary one and to guarantee the quality of the project. The cleanroom environment has been established. Therefore, when entering the cleanroom for secondary distribution construction, one must strictly abide by the management regulations of the cleanroom to ensure dust-free operation. Only by establishing effective safety, quality and environmental management systems can the smooth progress of secondary mixing be ensured.
By understanding and being familiar with the chip production process and grasping the secondary assembly requirements of equipment at each process stage, the progress of the secondary assembly project can be effectively promoted and the implementation quality of secondary assembly can be improved. The training and mastery of special pipeline construction techniques, the sufficient inventory of special accessories, the thorough understanding of primary assembly, regular point progress meetings, and the effective safety, quality and environmental management systems have laid a solid foundation for the effective implementation of secondary assembly of process equipment. At the same time, it is hoped that the above viewpoints and methods can serve as a reference for similar secondary distribution projects in workshops.
